881F Series - NANO²® Fast Opening High Current Subminiature Surface Mount Fuse

Brand: Littelfuse, Inc

The 881F Series NANO²® fuse is a relatively small sized, high-current, surface-mount fuse which provides overcurrent protection for applications of high operating current in a limited space.

This is the faster opening version of the original 881 Series which offers faster opening response during current overload conditions, protecting downstream components from getting damaged.

Such applications are mostly served today through a single large-sized high-current industrial type fuse or in some cases, parallel configuration of lower amperage SMD fuses.

The 881F Series fuses provide the option of a single fuse solution for protection for such application requirements.
Features
  • Available in ratings of 70A, 80A, and 100A
  • High interrupting rating - 1500A@75VDC
  • Faster opening time response for 200% OL current
  • Robust and solderless fuse design
  • Surface mountable high-current fuse
  • Single fuse solution for high current application
  • Suitable for a wide variety of voltage requirement and application
  • Ensures downstream component protection during current overload conditions
  • Enhanced product reliability and performance
  • Compatible with high volume assembly requirements

Specifications

Materials

  • Body: Thermoplastic, RTI 150° C
  • Terminations: Tin-Plated Copper

Product Marking

  • Brand logo, Voltage Rating, ‘F’ (Faster Opening Time), and Ampere Rating

Operating Temperature

  • -55° to +100° C with proper derating
  • Based on loading at 75 % of ampere rating when mounted using recommended pad layout
  • Usage outside of stated operating temperature range requires testing in application. Maintain case temperature below 150° C in application

Thermal Shock

  • MIL-STD-202, Method 107, Test Condition B (5 cycles -65° to 125° C)

Moisture Resistance

  • MIL-STD-202 Method 106, High Humidity (90-98 % RH), Heat (65° C)

Vibration

  • MIL-STD-202, Method 201 (10-55 Hz)

Mechanical Shock

  • MIL-STD-202, Method 213, Test Condition I (100 G’s peak for 6 ms)

Resistance to Soldering Heat

  • MIL-STD-202, Method 210, Test Condition B (10 sec at 260° C)

Solderability

  • MIL-STD-202, Method 208

MSL Test

  • Level 1 J-STD-020

Salt Fog

  • MIL-STD-202 Method 101 Test Condition B (5 % NaCl solution, 48 hours exposure)

Approvals

  • UL
  • TÜV

  • Blade Servers
  • Routers
  • High Power Battery Systems
  • Power Factor Correction (PFC) in High-Wattage Power Supplies
  • Power Distribution Units

Documentation

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